Chip cooling ==> new solver available
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Chip cooling ==> new solver available
There is a new solver for using with the cfdof-wb GUI: buoyantSimpleFoam
https://github.com/jaheyns/CfdOF
I ran a simple test-case, chip-cooling.
Dependency-checks ok.
During calculation, only the k/omega residuals are plotted.
I have no experience with buoyantSimpleFoam, comments welcome.
My openfoam version: bluecfd-core 2017-2
Freecad:
OS: Windows 10 (10.0)
Word size of OS: 64-bit
Word size of FreeCAD: 64-bit
Version: 0.19.21937 (Git)
Build type: Release
Branch: master
Hash: 0de5a290113800dc5779a76d7e216bd882e0ed1e
Python version: 3.6.8
Qt version: 5.12.1
Coin version: 4.0.0a
OCC version: 7.3.0
Locale: German/Germany (de_DE)
https://github.com/jaheyns/CfdOF
I ran a simple test-case, chip-cooling.
Dependency-checks ok.
During calculation, only the k/omega residuals are plotted.
I have no experience with buoyantSimpleFoam, comments welcome.
My openfoam version: bluecfd-core 2017-2
Freecad:
OS: Windows 10 (10.0)
Word size of OS: 64-bit
Word size of FreeCAD: 64-bit
Version: 0.19.21937 (Git)
Build type: Release
Branch: master
Hash: 0de5a290113800dc5779a76d7e216bd882e0ed1e
Python version: 3.6.8
Qt version: 5.12.1
Coin version: 4.0.0a
OCC version: 7.3.0
Locale: German/Germany (de_DE)
- oliveroxtoby
- Posts: 837
- Joined: Fri Dec 23, 2016 9:43 am
- Location: South Africa
Re: Chip cooling ==> new solver available
Thanks for testing! The residual issue should be resolved.thschrader wrote: ↑Sat Aug 15, 2020 10:10 am There is a new solver for using with the cfdof-wb GUI: buoyantSimpleFoam
https://github.com/jaheyns/CfdOF
I ran a simple test-case, chip-cooling.
chipCooling.FCStd
Dependency-checks ok.
During calculation, only the k/omega residuals are plotted.
I have no experience with buoyantSimpleFoam, comments welcome.
My openfoam version: bluecfd-core 2017-2
Freecad:
OS: Windows 10 (10.0)
Word size of OS: 64-bit
Word size of FreeCAD: 64-bit
Version: 0.19.21937 (Git)
Build type: Release
Branch: master
Hash: 0de5a290113800dc5779a76d7e216bd882e0ed1e
Python version: 3.6.8
Qt version: 5.12.1
Coin version: 4.0.0a
OCC version: 7.3.0
Locale: German/Germany (de_DE)
chip_cooling-test.JPG
Re: Chip cooling ==> new solver available
Hi,
i did some testing with this new solver.
I used this sample file as a basis.
There are problems with BC "constant heat flux" where simulation is aborted:
OpenFOAM IO error: wrong token type - expected Scalar, found on line 47 the word 'None' file: C:/Users/
UserName/Documents/FreeCad/Temp/case/0/T.boundaryField.chip.gradient at line 47.
14.9: Simulation exited with error
Reason: gradient of BC "Chip" is set to "none" instead to defined value
i did some testing with this new solver.
I used this sample file as a basis.
There are problems with BC "constant heat flux" where simulation is aborted:
OpenFOAM IO error: wrong token type - expected Scalar, found on line 47 the word 'None' file: C:/Users/
UserName/Documents/FreeCad/Temp/case/0/T.boundaryField.chip.gradient at line 47.
14.9: Simulation exited with error
Reason: gradient of BC "Chip" is set to "none" instead to defined value
- oliveroxtoby
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- Location: South Africa
Re: Chip cooling ==> new solver available
Thank you for reporting. This should be resolved.Greg66 wrote: ↑Wed Aug 19, 2020 7:45 pm Hi,
i did some testing with this new solver.
I used this sample file as a basis.
There are problems with BC "constant heat flux" where simulation is aborted:
OpenFOAM IO error: wrong token type - expected Scalar, found on line 47 the word 'None' file: C:/Users/
UserName/Documents/FreeCad/Temp/case/0/T.boundaryField.chip.gradient at line 47.
14.9: Simulation exited with error
Reason: gradient of BC "Chip" is set to "none" instead to defined value
Re: Chip cooling ==> new solver available
Upon further testing i discovered another issue with material library.oliveroxtoby wrote: ↑Thu Aug 20, 2020 8:10 pmThank you for reporting. This should be resolved.Greg66 wrote: ↑Wed Aug 19, 2020 7:45 pm Hi,
i did some testing with this new solver.
I used this sample file as a basis.
There are problems with BC "constant heat flux" where simulation is aborted:
OpenFOAM IO error: wrong token type - expected Scalar, found on line 47 the word 'None' file: C:/Users/
UserName/Documents/FreeCad/Temp/case/0/T.boundaryField.chip.gradient at line 47.
14.9: Simulation exited with error
Reason: gradient of BC "Chip" is set to "none" instead to defined value
I want to do a simulation with water as fluid using this solver. The requird properties of water (and other liquids) are not existing in your database. The database seems to be corrupted somehow qas you can see in attached picture. Only data of "Air" are available.
On writing the OF-simulation case the thermophysicalProperties file is always set up as "ideal gas". For liquids like water this is not suitable. I would recommend to utilise a polynomial approach like explained here for water: https://holzmann-cfd.com/community/blog ... ties-water
I used this polynomial approach by replacing the original file and it works quite well.
p.s. I do have a big database with physical properties at hand. This database contains several hundred components and comes from another Open Source project for process simulations. If you want, you can contact me on how to utilise this for your tool. This would be a great new feature!
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- oliveroxtoby
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- Location: South Africa
Re: Chip cooling ==> new solver available
It's not really corrupted - I just didn't get around to adding the extended properties for anything except air. It shouldn't show them, of course, but you can always enter your own values for the material you are using.Greg66 wrote: ↑Fri Aug 21, 2020 2:48 pm Upon further testing i discovered another issue with material library. :o
I want to do a simulation with water as fluid using this solver. The requird properties of water (and other liquids) are not existing in your database. The database seems to be corrupted somehow qas you can see in attached picture. Only data of "Air" are available.
Any contribution by members of the community in adding these values would be very much appreciated. No programming needed.
Those are great suggestions but not something I have time to do myself. Please consider contributing.On writing the OF-simulation case the thermophysicalProperties file is always set up as "ideal gas". For liquids like water this is not suitable. I would recommend to utilise a polynomial approach like explained here for water: https://holzmann-cfd.com/community/blog ... ties-water
I used this polynomial approach by replacing the original file and it works quite well.
p.s. I do have a big database with physical properties at hand. This database contains several hundred components and comes from another Open Source project for process simulations. If you want, you can contact me on how to utilise this for your tool. This would be a great new feature! :P
Thanks
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Re: Chip cooling ==> new solver available
2 questions:oliveroxtoby wrote: ↑Fri Aug 21, 2020 3:53 pm ...
I just didn't get around to adding the extended properties for anything except air.
...
cfdof uses the materials located in
C:\Users\xyz\AppData\Roaming\FreeCAD\Mod\CfdOF\data\CfdFluidMaterialProperties
right?
For editing new fluids, I must use the air material as reference, right? (I mean the order of the entries..)
Re: Chip cooling ==> new solver available
I offer you to prepare a database with these components containing the required parameters!Those are great suggestions but not something I have time to do myself. Please consider contributing.
i checked the suggestion by THSchrader to edit the existing database file for water and to supply some missing parameters for water.
The new parameters are showing up in the dialog now. So far so good.
BUT !!! The actual file is only created for an ideal gas model
-> this means, that you only can simulate gases but no liquids
==>> please consider to create a thermophysicalProperties file as you do now only for gases!!
==>> for liquids you should create this file with a polynomials approach as mentioned earlier.
- oliveroxtoby
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Re: Chip cooling ==> new solver available
Yesthschrader wrote: ↑Fri Aug 21, 2020 4:16 pm 2 questions:
cfdof uses the materials located in
C:\Users\xyz\AppData\Roaming\FreeCAD\Mod\CfdOF\data\CfdFluidMaterialProperties
right?
Yes; the order doesn't matter.For editing new fluids, I must use the air material as reference, right? (I mean the order of the entries..)
fluidProperties.JPG
Thanks!
- oliveroxtoby
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Re: Chip cooling ==> new solver available
I fully agree with your suggestions and thank you for the offer. However unfortunately this is not something I personally have time for at the moment, but I will happily review any pull requests containing such enhancements.Greg66 wrote: ↑Fri Aug 21, 2020 5:53 pmI offer you to prepare a database with these components containing the required parameters!Those are great suggestions but not something I have time to do myself. Please consider contributing.
i checked the suggestion by THSchrader to edit the existing database file for water and to supply some missing parameters for water.
The new parameters are showing up in the dialog now. So far so good.
BUT !!! The actual file is only created for an ideal gas model
-> this means, that you only can simulate gases but no liquids
==>> please consider to create a thermophysicalProperties file as you do now only for gases!!
==>> for liquids you should create this file with a polynomials approach as mentioned earlier.